Deposition Technologies



DEPOSITION TECHNOLOGIES

Techniques for high precision deposition
Combination of Large-Area Pulsed Laser Deposition(LA-PLD) and Magnetron Sputter Deposition (MSD)
High precision deposition of nanometer single and multilayers
Accuracy and homogeneity in the sub-nanometer range
Multilayer stacks for a wide variety of applications
Constant and graded thickness distributions
Deposition of rectangular substrates and substrates up to 8 inch diameter (LA-PLD)








Magnetron Sputter Deposition

Homogeneity: 99.9% (6" diameter)
Run-to-run stability: 99.9%
Performance of Mo/Si multilayers:
Cu Kα reflectivity for d = 2.0 nm
R (Cu Kα) < 60%
EUV-range*: reflectivity for d = 6.82 nm:
R (λ = 13.3 nm) = 70.1%





Large-Area Pulsed Laser Deposition

Homogeneity: 99.5% (80 mm x 40 mm)
run-to-run stability: 99.5%
Cu Kα reflectivity of a Ni/C-Multilayer
d = 3.0 nm: R = 68%








Application of PLD: Inside deposition of tubes*

Glass tubes (I.D. ~10 mm), in-side deposited with Au, Cu, Ni, Pd, brass, C


* in cooperation with Fraunhofer IWS Dresden, Germany:

IWS Website

Coating of optical components for
EUV and X-ray optical applications


Thin film technology -
PVD coating by activated high rate processes






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